SCHOLARSHIP PROGRAM FOR DIASPORA CHILDREN FOR ACADEMIC SESSION 2019-’20

SCHOLARSHIP PROGRAM FOR DIASPORA CHILDREN FOR ACADEMIC SESSION 2019-'20

Government of India launched a scheme called “Scholarship Programme for Diaspora Children” (SPDC), in the academic year 2006-2007, for the wards of Persons of Indian Origin (PIOs) and Non-Resident Indians (NRIs) to assist them in pursuing Under Graduate courses in Indian Universities/Institutes.

Under SPDC scheme financial assistance for specific undergraduate courses in Professional and Non-Professional courses (except Medical and related courses)is provided towards tuition fee, admission fee and post admission services. The scheme is applicable to NRIs and PIOs from 66 countries.

Under the scheme, PIO/NRI students are awarded a scholarship of up to US$4,000 per annum for payment of tuition fee, admission fee and post admission services for Undergraduate courses in Engineering, Technology, Humanities, Liberal Arts, Commerce, Management, Journalism, Hotel Management, Agriculture, Animal Husbandry and other courses. The scholarship is applicable to students who have already secured admission in an Indian institution. Admission is   permitted only in Central Universities, NAAC “A” Grade Institutions, National Institute of Technologies (NITs), School of Planning & Architecture (SPAs), and Indian Institute of Information Technology (IIITs) as covered under Direct Admission of Students Abroad (DASA) scheme.

In case of any technical assistance, please contact following: SPDC Portal Support Team, EG & IT Division, MEA, 1025, A Wing, Jawaharlal Nehru Bhavan
23-D Janpath, New Delhi 110011, Email: technicalcellegit@mea.gov.in, Tel. +91 11 4901 8371

In case of any assistance/clarification regarding Scholarship Programme for Diaspora Children, please contact following: Section Officer, OIA II Division, MEA, 925, Akbar Bhawan, Chankyapuri, New Delhi 110021, Email: so1oia2@mea.gov.in, Tel.: +91 11 2419 7927; Or Visitwww.spdcindia.gov.in

Last date for application is Nov. 30, 2019.

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